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Polishing Pad
We specialize in manufacturing Polishing Pad, Pad and PU Polish Pad for many years in Taiwan.
- Specification
Code No. Size(mm) Application PU 100 Dia 960 Sapphire wafer, Ceramic Substrate , Patterned Metal Circuit
Physical Characters
Code No. Thickness (mm) Density (g/cm3) Hardness (Shore A) Compressibility (%) PU 100 0.8~2.2 0.85 48.6 1.6~1.7
